Processor
• Intel® Ultra Arrow Lake-H, Up to 99 Tops
Chipset
• No external chipset (PCH‑less Arrow Lake SoC design)
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Graphics
• 1 × HDMI 1.4 • 6 × USB‑C with DisplayPort Alt‑Mode • Optional MXM GPU module for enhanced AI/GPU performance
Memory
• Onboard 16G/32/64GB LPDDR5
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Network
• 4 x Intel GbE LAN ( 1xi219V, 2xi226V, 1xi210AT ) • 1 x M.2 Key E for wifi/BT • 1 x M.2 Key B for 4G/5G
Expansion Slot
• 1 x M.2 KEY E，for wifi • 1 x M.2 KEY B，for 4G/5G Cellular • 1 x MXM for AI/GPU Modules 82mm*105mm
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Storage
• 1x M.2 Key M for NVME(PCIE X4)
Audio
• 1 x 3.5mm Stereo Jack • 1 x Microphone Array
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Back Panel I/O
• 1 x DC IN • 4 x RS-485, 115200bps • 2 x RS232/RS485, 115200bps • 2 x CAN FD • 8 x GPIO • 1 x SIM card • 1 x 3.5mm Audio • 1 x Microphone Array • 8 x GMSL
I/O
• 1 x Power button,1x SSD Led,1x Power Led (Front) • 6 x USB 3.0 Type-C（supports Graphics）(Front) • 4 x RJ45, 10/100/1000 Mbps(Front)
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Function
• TPM 2.0 • Watchdog • 1x TTL Debug
Chassis
• Dimensions: 130mm x 125mm x 70mm
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Power Supply
• Power: DC 12~36V 2-pin Phoenix
OS Support
• Windows, ROS2, Linux
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Applications
• Drone, Robot, Smart Vehicles, Smart Manufacture, AI Edge, Visual computing. etc.
Environment
• Operating Temperature: -20 to +65 C • Non operating temperature: -40 to +85 C • Operating Relative Humidity: 10% to 90% (non-condensing) • MTBF: 100,000 Hours • FCC, CE, RoHS Certified
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